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密闭机箱风冷散热结构设计与分析

Author(s)：
谢锦荣

Publication Title：

Wen Yuan (Middle School Edition) 2021 No.10

Affiliations：
全亿大科技（佛山）有限公司广东佛山 528100

Abstract：
随着电子元器件的小型化、微型化和集成化技术的发展，电子元器件和设备的装配密度迅速增加，元器件和设备的热流密度也迅速增加。研究表明，电子元器件的失效率随着温度的升高而增加，温度每升高10°C，电子元器件的失效率就会增加一倍，电子设备的平均使用寿命也会随着工作温度的升高而降低。如何保证电子元器件在规定的热环境中按照预定的参数稳定可靠地工作，已经成为电子设备结构设计中必须考虑的重要因素之一。

Keywords：
电子设备；风冷散热；机箱

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[1] 谢锦荣.密闭机箱风冷散热结构设计与分析[J].Wen Yuan (Middle School Edition),2021(10),.

文渊(中学版)

Wen Yuan (Middle School Edition)

Language: 中文

CN：11-9275/G

ISSN：2096-627X

Publication Frequency: 月刊

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