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Home > Wen Yuan (High School Edition) > 2021 No.08 > SMT焊接不良分析及改善

  • SMT焊接不良分析及改善

    Author(s)：

    裴丽琴

    Publication Title：

    Wen Yuan (High School Edition) 2021 No.08

    Affiliations：

    积成电子股份有限公司

    Abstract：

    对SMT焊接过程中出现的不良现象进行深入剖析，寻找问题根源，提出解决问题的有效方法并予以改善。

    Keywords：

    SMT焊接；不良分析；改善

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    [1] 裴丽琴.SMT焊接不良分析及改善[J].Wen Yuan (High School Edition),2021(08),.

文渊(高中版)
Wen Yuan (High School Edition)

Language: 中文

CN：11-9276/G

ISSN：2096-6288

Publication Frequency: 月刊

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